Engineering
Power Electronics
100%
Bonded Interface
60%
Thermal Performance
43%
Renewable Energy
33%
Heat Resistance
31%
Material Interface
24%
Automotives
23%
Failure Mechanism
18%
Metal-Oxide-Semiconductor Field-Effect Transistor
16%
Electric Motor
16%
Electric Machine
14%
Grease
13%
Baseplate
13%
Coefficient of Thermal Expansion
12%
Transients
12%
Thermal Cycle
11%
Band Gap
11%
Sintering
11%
Delamination
11%
Thermal Conductivity
10%
Electronic Design
10%
Crack Propagation
10%
Electronic Module
9%
Nitride
9%
Interconnects
9%
Substrate Material
9%
Finite Element Analysis
9%
Power Converter
9%
Power Density
9%
Electronic Packaging
9%
Progress Report
8%
Exchanger
7%
Silver Paste
7%
Module Design
6%
Heat Removal
6%
Microchannel
6%
Copper Substrate
6%
State of Health
6%
Degree Celsius
6%
Insulated Gate Bipolar Transistor
5%
Accelerated Test
5%
Joints (Structural Components)
5%
Major Type
5%
Degradation Model
5%
Electrolytic Capacitor
5%
Common Mode
5%
Mode Noise
5%
Electrical Performance
5%
Cooling Performance
5%
Bipolar Transistor
5%
Material Science
Silver
44%
Thermal Cycling
40%
Heat Resistance
36%
Interface (Material)
33%
Silicon Carbide
16%
Multilayers
14%
Metal-Oxide-Semiconductor Field-Effect Transistor
14%
Crack Propagation
13%
Thermal Expansion
12%
Thermal Conductivity
11%
Delamination
11%
Aluminum
10%
Contact Resistance
10%
Thermoplastics
8%
Stress Intensity Factor
8%
Electronic Materials
8%
Sintering
7%
Electronic Circuit
7%
Bipolar Transistor
6%
Crack Initiation
6%
Phase Change Material
5%
Capacitor
5%
Stress Intensity
5%
Finite Element Modeling
5%
Thermal Aging
5%
