Research Output per Year
Research Output per Year
Search results
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2019
Thermomechanical Modeling of High-Temperature Bonded Interface Materials
Paret, P. P., DeVoto, D. J. & Narumanchi, S. V. J., 29 Jan 2019, Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability. Siow, K. S. (ed.). Springer International Publishing, p. 107-124 18 p.Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review
Open Access4 Scopus Citations