| Event title | ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 |
|---|---|
| Location | Burlingame, CA, United StatesShow on map |
| Period | 16 Jul 2013 → 18 Jul 2013 |
ASME InterPACK Conference Outstanding Paper Award, Second Place
- DeVoto, Douglas (Recipient) & Paret, Paul (Recipient)
Prize: Honorary award