A High Throughput, Noncontact System for Screening Silicon Wafers Predisposed to Breakage During Solar Cell Production

Bhushan Sopori; Przemyslaw Rupnowski; Prakash Basnyat; Vishal Mehta

doi:10.1109/pvsc.2011.6186153

A High Throughput, Noncontact System for Screening Silicon Wafers Predisposed to Breakage During Solar Cell Production

Bhushan Sopori, Przemyslaw Rupnowski, Prakash Basnyat, Vishal Mehta

Materials Science

National Renewable Energy Laboratory

Research output: Contribution to conference › Paper › peer-review

1 Scopus Citations

Abstract

We describe a non-contact, on-line system for screening wafers that are likely to break during solar cell/module fabrication. The wafers are transported on a conveyor belt under a light source, which illuminates the wafers with a specific light distribution. Each wafer undergoes a dynamic thermal stress whose magnitude mimics the highest stress the wafer will experience during cell/module fabrication. As a result of the stress, the weak wafers break, leaving only the wafers that are strong enough to survive the production processes. We will describe the mechanism of wafer breakage, introduce the wafer system, and discuss the results of the time-temperature (t-T) profile of wafers with and without microcracks.

Original language	American English
Pages	1134-1139
Number of pages	6
DOIs	https://doi.org/10.1109/pvsc.2011.6186153 https://doi.org/10.1109/PVSC.2011.6186153
State	Published - 2011
Event	37th IEEE Photovoltaic Specialists Conference, PVSC 2011 - Seattle, WA, United States Duration: 19 Jun 2011 → 24 Jun 2011

Conference

Conference	37th IEEE Photovoltaic Specialists Conference, PVSC 2011
Country/Territory	United States
City	Seattle, WA
Period	19/06/11 → 24/06/11

NREL Publication Number

NREL/AB-5200-50703

Keywords

silicon wafers
solar cell production
solar module fabrication

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Sopori, B., Rupnowski, P., Basnyat, P., & Mehta, V. (2011). A High Throughput, Noncontact System for Screening Silicon Wafers Predisposed to Breakage During Solar Cell Production. 1134-1139. Paper presented at 37th IEEE Photovoltaic Specialists Conference, PVSC 2011, Seattle, WA, United States. https://doi.org/10.1109/pvsc.2011.6186153, https://doi.org/10.1109/PVSC.2011.6186153

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title = "A High Throughput, Noncontact System for Screening Silicon Wafers Predisposed to Breakage During Solar Cell Production",

abstract = "We describe a non-contact, on-line system for screening wafers that are likely to break during solar cell/module fabrication. The wafers are transported on a conveyor belt under a light source, which illuminates the wafers with a specific light distribution. Each wafer undergoes a dynamic thermal stress whose magnitude mimics the highest stress the wafer will experience during cell/module fabrication. As a result of the stress, the weak wafers break, leaving only the wafers that are strong enough to survive the production processes. We will describe the mechanism of wafer breakage, introduce the wafer system, and discuss the results of the time-temperature (t-T) profile of wafers with and without microcracks.",

keywords = "silicon wafers, solar cell production, solar module fabrication",

author = "Bhushan Sopori and Przemyslaw Rupnowski and Prakash Basnyat and Vishal Mehta",

year = "2011",

doi = "10.1109/pvsc.2011.6186153",

language = "American English",

pages = "1134--1139",

note = "37th IEEE Photovoltaic Specialists Conference, PVSC 2011 ; Conference date: 19-06-2011 Through 24-06-2011",

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Sopori, B, Rupnowski, P, Basnyat, P & Mehta, V 2011, 'A High Throughput, Noncontact System for Screening Silicon Wafers Predisposed to Breakage During Solar Cell Production', Paper presented at 37th IEEE Photovoltaic Specialists Conference, PVSC 2011, Seattle, WA, United States, 19/06/11 - 24/06/11 pp. 1134-1139. https://doi.org/10.1109/pvsc.2011.6186153, https://doi.org/10.1109/PVSC.2011.6186153

A High Throughput, Noncontact System for Screening Silicon Wafers Predisposed to Breakage During Solar Cell Production. / Sopori, Bhushan; Rupnowski, Przemyslaw; Basnyat, Prakash et al.
2011. 1134-1139 Paper presented at 37th IEEE Photovoltaic Specialists Conference, PVSC 2011, Seattle, WA, United States.

Research output: Contribution to conference › Paper › peer-review

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T1 - A High Throughput, Noncontact System for Screening Silicon Wafers Predisposed to Breakage During Solar Cell Production

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AU - Basnyat, Prakash

AU - Mehta, Vishal

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N2 - We describe a non-contact, on-line system for screening wafers that are likely to break during solar cell/module fabrication. The wafers are transported on a conveyor belt under a light source, which illuminates the wafers with a specific light distribution. Each wafer undergoes a dynamic thermal stress whose magnitude mimics the highest stress the wafer will experience during cell/module fabrication. As a result of the stress, the weak wafers break, leaving only the wafers that are strong enough to survive the production processes. We will describe the mechanism of wafer breakage, introduce the wafer system, and discuss the results of the time-temperature (t-T) profile of wafers with and without microcracks.

AB - We describe a non-contact, on-line system for screening wafers that are likely to break during solar cell/module fabrication. The wafers are transported on a conveyor belt under a light source, which illuminates the wafers with a specific light distribution. Each wafer undergoes a dynamic thermal stress whose magnitude mimics the highest stress the wafer will experience during cell/module fabrication. As a result of the stress, the weak wafers break, leaving only the wafers that are strong enough to survive the production processes. We will describe the mechanism of wafer breakage, introduce the wafer system, and discuss the results of the time-temperature (t-T) profile of wafers with and without microcracks.

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KW - solar module fabrication

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T2 - 37th IEEE Photovoltaic Specialists Conference, PVSC 2011

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A High Throughput, Noncontact System for Screening Silicon Wafers Predisposed to Breakage During Solar Cell Production

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