Adhesion and Thin-Film Module Reliability: Preprint

Research output: Contribution to conferencePaper

Abstract

Among the infrequently measured but essential properties for thin-film (T-F) module reliability are the interlayer adhesion and cohesion within a layer. These can be cell contact layers to glass, contact layers to the semiconductor, encapsulant to cell, glass, or backsheet, etc. We use an Instron mechanical testing unit to measure peel strengths at 90..deg.. or 180..deg.. and, in some cases, ascratch and tape pull test to evaluate inter-cell layer adhesion strengths. We present peel strength data for test specimens laminated from the three T-F technologies, before and after damp heat, and in one instance at elevated temperatures. On laminated T-F cell samples, failure can occur uniformly at any one of the many interfaces, or non-uniformly across the peel area at more than oneinterface. Some peel strengths are << 1 N/mm. This is far below the normal Instron mechanical testing unit Instron mechanical testing unit /glass interface values of >10 N/mm. We measure a wide range of adhesion strengths and suggest that adhesion measured under higher temperature and relative humidity conditions is more relevant for module reliability.
Original languageAmerican English
Number of pages6
StatePublished - 2006
Event2006 IEEE 4th World Conference on Photovoltaic Energy Conversion (WCPEC-4) - Waikoloa, Hawaii
Duration: 7 May 200612 May 2006

Conference

Conference2006 IEEE 4th World Conference on Photovoltaic Energy Conversion (WCPEC-4)
CityWaikoloa, Hawaii
Period7/05/0612/05/06

NREL Publication Number

  • NREL/CP-520-39732

Keywords

  • cohesion
  • contact layers
  • Instron mechanical testing unit
  • interlayer adhesion
  • module reliability
  • PV

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