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Adhesion and Thin-Film Module Reliability: Preprint
NREL
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Dive into the research topics of 'Adhesion and Thin-Film Module Reliability: Preprint'. Together they form a unique fingerprint.
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Engineering
Film Module
100%
Thin Films
100%
Peel Strength
75%
Elevated Temperature
25%
Film Cell
25%
Damp Heat
25%
Film Technology
25%
Mechanical Testing
25%
Test Specimen
25%
Adhesion Layer
25%
Pull Test
25%
Relative Humidity
25%
Interlayer
25%
Material Science
Thin Films
100%
Bond Strength (Materials)
50%
Mechanical Testing
25%