Adhesion Degradation of the Metallization-Encapsulant Interface

Nicholas Bosco, Peter Hacke, Sarah Kurtz, Jared Tracy, Reinhold Dauskardt

Research output: Contribution to conferencePaper


Adhesion of the silver metallization/ encapsulant interface was measured through temperature, humidity and voltage bias stress. Results indicate that adhesion at this interface is severely compromised by even short exposures to humidity and quickly plateaus with further, prolonged, exposure. The magnitude of degradation is also identical to that measured through a three-month outdoor, on-sun, exposure. While the addition of a voltage bias also appears capable of further degrading adhesion below this plateau level, in the absence of humidity, adhesion may be similarly degraded.
Original languageAmerican English
Number of pages4
StatePublished - 2017
Event33rd European Photovoltaic Solar Energy Conference and Exhibition - Amsterdam, The Netherlands
Duration: 25 Sep 201729 Sep 2017


Conference33rd European Photovoltaic Solar Energy Conference and Exhibition
CityAmsterdam, The Netherlands

NREL Publication Number

  • NREL/CP-5K00-67977


  • degradation
  • encapsulation
  • metallization
  • reliability
  • screen printing


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