Adhesion Degradation of the Metallization-Encapsulant Interface

Adhesion of the silver metallization/ encapsulant interface was measured through temperature, humidity and voltage bias stress. Results indicate that adhesion at this interface is severely compromised by even short exposures to humidity and quickly plateaus with further, prolonged, exposure. The magnitude of degradation is also identical to that measured through a three-month outdoor, on-sun, exposure. While the addition of a voltage bias also appears capable of further degrading adhesion below this plateau level, in the absence of humidity, adhesion may be similarly degraded.