Abstract
This study evaluates a jet impingement based cooling strategy combined with microfinned enhanced surfaces as a means of improving thermal management for power electronic devices. For comparison, a baseline channel flow heat exchanger and jet impingement on plain surfaces are characterized. The jets, augmented with enhanced microfinned surfaces, provide localized cooling to areas heated by the insulated-gate bipolar transistors and diode devices. Lighter materials and simpler manufacturing while managing required pumping power increase the overall performance while reducing weight, volume, and cost. Computational fluid dynamics modeling validated by experiments was used to characterize the baseline as well as jet-impingement-based heat exchangers at typical automotive flow rates using a 50%-50% mixture by volume of water and ethylene glycol. The three cooling configurations were tested at full inverter power (40 to 100 kW output power) on a dynamometer. An increased thermal performance was observed for the jet-impingement configurations. Experiments were also performed to investigate the long-term reliability of the jets impinging on enhanced surfaces.
Original language | American English |
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Pages | 1064-1073 |
Number of pages | 10 |
DOIs | |
State | Published - 2014 |
Event | 14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014 - Orlando, United States Duration: 27 May 2014 → 30 May 2014 |
Conference
Conference | 14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014 |
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Country/Territory | United States |
City | Orlando |
Period | 27/05/14 → 30/05/14 |
Bibliographical note
See NREL/CP-5400-61060 for preprintNREL Publication Number
- NREL/CP-5400-63187
Keywords
- enhanced surfaces
- heat transfer
- inverter thermal management
- jet-impingement
- microfinned surfaces
- power electronics
- single-phase liquid cooling