@misc{370d81ea35a74be59d4f86989cccca4f,
title = "Advanced Packaging Designs (Keystone Project 1)",
abstract = "The primary deliverable for this project will be to demonstrate an optimized power module design, with a ceramic-free electrically insulating substrate, through the development of a rapid multiphysics optimization workflow.",
keywords = "packaging, power electronics, reliability, substrates",
author = "Douglas DeVoto",
year = "2024",
language = "American English",
series = "Presented at the U.S. Department of Energy (DOE) Vehicle Technologies Office (VTO) 2024 Annual Merit Review, 3-6 June 2024, Arlington, Virginia",
type = "Other",
}