Advanced Power Electronics Designs - Reliability and Prognostics

Research output: NRELPoster


The electrical interconnection and isolation design aspects within an inverter must also provide high thermal performance and thermomechanical reliability. In collaboration with ORNL, DuPont, and Indiana Integrated Circuits (IIC), NREL is evaluating new packaging materials and manufacturing techniques for wide-bandgap-based traction inverters. Thermal modeling and experimental evaluation revealed that an organic direct-bond-copper (ODBC) substrate has similar thermal resistance to traditional ceramic substrates. High-temperature thermal cycling has shown the ODBC substrates to have greater reliability than ceramic substrates which is a significant finding in the quest for low-cost, power-dense, high-temperature power electronics. IIC's direct chip-to-chip topside electrical connection will be attached to ODBC substrates and reliability evaluation for both technologies will be performed at NREL in Q4.
Original languageAmerican English
StatePublished - 2019

Publication series

NamePresented at the 2019 Vehicle Technologies Office Annual Merit Review and Peer Evaluation Meeting, 10-13 June 2019, Arlington, Virginia

NREL Publication Number

  • NREL/PO-5400-73550


  • electrical interconnection
  • power electronics
  • reliability
  • thermal modeling
  • traction inverter
  • wide bandgap


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