Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)

Research output: NRELPresentation


The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.
Original languageAmerican English
Number of pages21
StatePublished - 2020

Publication series

NamePresented at the 2020 Vehicle Technologies Office Annual Merit Review and Peer Evaluation Meeting, 1-4 June 2020

NREL Publication Number

  • NREL/PR-5400-76667


  • interconnects
  • packaging
  • power electronics
  • reliability
  • substrates


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