@misc{db0a0dcc020c490c8c87662059b24568,
title = "Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)",
abstract = "The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.",
keywords = "interconnects, packaging, power electronics, reliability, substrates",
author = "Douglas DeVoto",
year = "2021",
language = "American English",
series = "Presented at the 2021 DOE Vehicle Technologies Office Annual Merit Review and Peer Evaluation Meeting, 21-25 June 2021",
type = "Other",
}