Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)

Research output: NRELPresentation


The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.
Original languageAmerican English
Number of pages22
StatePublished - 2021

Publication series

NamePresented at the 2021 DOE Vehicle Technologies Office Annual Merit Review and Peer Evaluation Meeting, 21-25 June 2021

NREL Publication Number

  • NREL/PR-5400-79924


  • interconnects
  • packaging
  • power electronics
  • reliability
  • substrates


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