@misc{53f63d68263b43b5b7554b4f20a06249,
title = "Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)",
abstract = "The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.",
keywords = "interconnects, packaging, power electronics, reliability, substrates",
author = "Douglas DeVoto",
year = "2022",
language = "American English",
series = "Presented at the 2022 Vehicle Technologies Office Annual Merit Review, 21-23 June 2022, Washington, D.C.",
type = "Other",
}