Abstract
This work demonstrates a direct air-cooled heat exchanger strategy for high-temperature power electronic devices with an application specific to automotive traction drive inverters. We present experimental heat dissipation and system pressure curves versus flow rate for baseline and optimized sub-module assemblies containing two ceramic resistance heaters that provide device heat fluxes. The maximum allowable junction temperature was set to 175 degrees C. Results were extrapolated to the inverter scale and combined with balance-of-inverter components to estimate inverter power density and specific power. The results exceeded the goal of 12 kW/L and 12 kW/kg for power density and specific power, respectively.
| Original language | American English |
|---|---|
| Number of pages | 6 |
| State | Published - 2015 |
| Event | 2014 IEEE Compound Semiconductor IC Symposium - San Diego, California Duration: 19 Oct 2014 → 22 Oct 2014 |
Conference
| Conference | 2014 IEEE Compound Semiconductor IC Symposium |
|---|---|
| City | San Diego, California |
| Period | 19/10/14 → 22/10/14 |
NREL Publication Number
- NREL/CP-5400-61844
Keywords
- electronic packaging thermal management
- electronics cooling
- semiconductors
- thermal management of electronics
- wide band gap