Air-Cooled Heat Exchanger for High-Temperature Power Electronics: Preprint

Scot Waye, Jason Lustbader, Charles King

Research output: Contribution to conferencePaper


This work demonstrates a direct air-cooled heat exchanger strategy for high-temperature power electronic devices with an application specific to automotive traction drive inverters. We present experimental heat dissipation and system pressure curves versus flow rate for baseline and optimized sub-module assemblies containing two ceramic resistance heaters that provide device heat fluxes. The maximum allowable junction temperature was set to 175 degrees C. Results were extrapolated to the inverter scale and combined with balance-of-inverter components to estimate inverter power density and specific power. The results exceeded the goal of 12 kW/L and 12 kW/kg for power density and specific power, respectively.
Original languageAmerican English
Number of pages6
StatePublished - 2015
Event2014 IEEE Compound Semiconductor IC Symposium - San Diego, California
Duration: 19 Oct 201422 Oct 2014


Conference2014 IEEE Compound Semiconductor IC Symposium
CitySan Diego, California

NREL Publication Number

  • NREL/CP-5400-61844


  • electronic packaging thermal management
  • electronics cooling
  • semiconductors
  • thermal management of electronics
  • wide band gap


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