Analyses of Diamond Wire Sawn Wafers: Effect of Various Cutting Parameters

Santosh Sahoo, James Gee, Hubert Seigneur, Rekha Schnepf, Ferdinando Severico, Antoine Manens, Winston Schoenfeld, Steve Preece

Research output: Contribution to conferencePaper

18 Scopus Citations


We have evaluated surface characteristics of diamond wire cut (DWC) wafers sawn under a variety of cutting parameters. These characteristics include surface roughness, spatial frequencies of surface profiles, phase changes, damage depth, and lateral non-uniformities in the surface damage. Various cutting parameters investigated are: wire size, diamond grit size, reciprocating frequency, feed rate, and wire usage. Spatial frequency components of surface topography/roughness are influenced by individual cutting parameters as manifested by distinct peaks in the Fourier transforms of the Dektak profiles. The depth of damage is strongly controlled by diamond grit size and wire usage and to a smaller degree by the wire size.
Original languageAmerican English
Number of pages6
StatePublished - 2015
Event2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC) - New Orleans, Louisiana
Duration: 14 Jun 201519 Jun 2015


Conference2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC)
CityNew Orleans, Louisiana

NREL Publication Number

  • NREL/CP-5J00-63642


  • damage
  • diamond
  • FFT
  • silicon
  • wire sawing


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