Abstract
We have evaluated surface characteristics of diamond wire cut (DWC) wafers sawn under a variety of cutting parameters. These characteristics include surface roughness, spatial frequencies of surface profiles, phase changes, damage depth, and lateral non-uniformities in the surface damage. Various cutting parameters investigated are: wire size, diamond grit size, reciprocating frequency, feed rate, and wire usage. Spatial frequency components of surface topography/roughness are influenced by individual cutting parameters as manifested by distinct peaks in the Fourier transforms of the Dektak profiles. The depth of damage is strongly controlled by diamond grit size and wire usage and to a smaller degree by the wire size.
Original language | American English |
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Number of pages | 6 |
DOIs | |
State | Published - 2015 |
Event | 2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC) - New Orleans, Louisiana Duration: 14 Jun 2015 → 19 Jun 2015 |
Conference
Conference | 2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC) |
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City | New Orleans, Louisiana |
Period | 14/06/15 → 19/06/15 |
NREL Publication Number
- NREL/CP-5J00-63642
Keywords
- damage
- diamond
- FFT
- silicon
- wire sawing