Anisotropic Thermal Response of Packed Copper Wire: Paper No. TSEA-16-1256

Justine Cousineau, Kevin Bennion, Andrew Wereszczak, Hsin Wang, Randy Wiles, Timothy Burress, Tong Wu

Research output: Contribution to journalArticlepeer-review

9 Scopus Citations

Abstract

The apparent thermal conductivity of packed copper wire test specimens was measured parallel and perpendicular to the axis of the wire using laser flash, transient plane source, and transmittance test methods. Approximately 50% wire packing efficiency was produced in the specimens using either 670 or 925 um diameter copper wires that both had an insulation coating thickness of 37 um. The interstices were filled with a conventional varnish material and also contained some remnant porosity. The apparent thermal conductivity perpendicular to the wire axis was about 0.5 - 1 W/mK whereas it was over 200 W/mK in the parallel direction. The Kanzaki model and an FEA model were found to reasonably predict the apparent thermal conductivity perpendicular to the wires but thermal conductivity percolation from non-ideal wire-packing may result in their underestimation of it.
Original languageAmerican English
Number of pages9
JournalJournal of Thermal Science and Engineering Applications
Volume9
Issue number4
DOIs
StatePublished - 2017

NREL Publication Number

  • NREL/JA-5400-66937

Keywords

  • anisotropy
  • coating processes
  • coatings
  • copper
  • cushioning
  • dynamics
  • lasers
  • packing
  • packings
  • shipments
  • thermal conductivity
  • transients
  • wire

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