@misc{c4c1dd4eda2e485195ca36747dd8d10a,
title = "Automotive Power Electronics and Electric Machine Thermal Management",
abstract = "The transition to modular and scalable electrified vehicle transportation requires technologies to improve power density within cost and reliability constraints to maximize vehicle platform flexibility. Key research challenges arise due to the limited packaging space, coolant distribution, electrical connections, and ambient temperatures. Challenges include thermal management for compact power-dense electric machines and the associated power electronics for power management within the vehicle. High-temperature silicon and wide-bandgap (WBG) based power electronics systems are of interest to enable compact and efficient electric drive systems. The higher temperatures present packaging challenges for thermal management and reliability. In this work, we provide an overview of research for thermal characteristics of materials, packages and thermal management approaches for enabling compact power dense automotive electric drive systems.",
keywords = "electric, power density, thermal management",
author = "Kevin Bennion and Bidzina Kekelia and Gilberto Moreno",
year = "2018",
language = "American English",
series = "Presented at the 18th IESF Automotive EE Design Conference, 19 September 2018, Plymouth, Michigan",
type = "Other",
}