Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink: Paper No. EP-23-1026

Engineering

• Power Electronics 100%
• Automotives 100%
• Copper Substrate 66%
• Electric Vehicle 66%
• Inverter 66%
• Power Density 33%
• Thermal Performance 33%
• Baseplate 33%
• Electronics Thermal Management 33%
• Flow Rate 33%
• Full Scale 33%
• Pumping Power 33%
• Search Algorithm 33%
• Cell Model 33%
• Additive Manufacturing 33%
• Model Prediction 33%
• Exhaustive Search 33%
• Reliability Standard 33%
• Pressure Drop 33%
• Band Gap 33%
• Heat Flux 33%
• Heat Resistance 33%
• Flow Velocity 33%