Chapter 20: Thermal

Sreekant Narumanchi; Madhusudan Iyengar; Avi Bar-Cohen; Ali Merrikh; Amr Helmy; Azmat Malik; Bahgat Sammakia; Baratunde Cola; Baris Dogruoz; Benson Chan; Bill Bottoms; Craig Green; Dhruv Singh; Gamal Refai-Ahmed; Jamal Yagoobi; Justin Weibel; Kamal Sikka; Kanad Ghose; Kenneth Goodson; Kevin Drummond; Li Shi; Mehdi Asheghi; Michael Barako; Michael Ellsworth; Peter Bock; Ravi Mahajan; Rockwell Hsu; Satish Kumar; Suresh Garimella; Timothy Chainer; Vadim Gektin; Victor Chiriac; Yoonjin Won; Yogi Joshi; Weihua Tang; William Chen

Chapter 20: Thermal

Sreekant Narumanchi, Madhusudan Iyengar, Avi Bar-Cohen, Ali Merrikh, Amr Helmy, Azmat Malik, Bahgat Sammakia, Baratunde Cola, Baris Dogruoz, Benson Chan, Bill Bottoms, Craig Green, Dhruv Singh, Gamal Refai-Ahmed, Jamal Yagoobi, Justin Weibel, Kamal Sikka, Kanad Ghose, Kenneth Goodson, Kevin DrummondLi Shi, Mehdi Asheghi, Michael Barako, Michael Ellsworth, Peter Bock, Ravi Mahajan, Rockwell Hsu, Satish Kumar, Suresh Garimella, Timothy Chainer, Vadim Gektin, Victor Chiriac, Yoonjin Won, Yogi Joshi, Weihua Tang, William Chen

Center for Integrated Mobility Sciences

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Abstract

Heterogeneous Integration poses several significant challenges for thermal management at multiple length scales ranging from heat extraction from hot spots, heat transfer through multiple layers of materials, different target temperatures for specific devices/materials, to heat rejection to a system cooling solution or the ambient. This Thermal Working Group (TWG) will consider three areas for thermal management: Die level; Package integration/System-in-Package (SIP)/module level; System level (limited to board level). In addition to the taxonomy of the physical categories listed above, this chapter will focus on articulating the following in quantitative (wherever possible) and qualitative terms: Canonical problems with thermal challenges; Cooling limits for known solutions; Advanced concepts and research.

Original language	American English
Title of host publication	Heterogeneous Integration Roadmap: 2019 Edition
State	Published - 2019

NREL Publication Number

NREL/CH-5400-73450

Keywords

heterogeneous integration
thermal management

Cite this

@inbook{c1ab35544835479cbc53bd4c6e403ef8,

title = "Chapter 20: Thermal",

abstract = "Heterogeneous Integration poses several significant challenges for thermal management at multiple length scales ranging from heat extraction from hot spots, heat transfer through multiple layers of materials, different target temperatures for specific devices/materials, to heat rejection to a system cooling solution or the ambient. This Thermal Working Group (TWG) will consider three areas for thermal management: Die level; Package integration/System-in-Package (SIP)/module level; System level (limited to board level). In addition to the taxonomy of the physical categories listed above, this chapter will focus on articulating the following in quantitative (wherever possible) and qualitative terms: Canonical problems with thermal challenges; Cooling limits for known solutions; Advanced concepts and research.",

keywords = "heterogeneous integration, thermal management",

author = "Sreekant Narumanchi and Madhusudan Iyengar and Avi Bar-Cohen and Ali Merrikh and Amr Helmy and Azmat Malik and Bahgat Sammakia and Baratunde Cola and Baris Dogruoz and Benson Chan and Bill Bottoms and Craig Green and Dhruv Singh and Gamal Refai-Ahmed and Jamal Yagoobi and Justin Weibel and Kamal Sikka and Kanad Ghose and Kenneth Goodson and Kevin Drummond and Li Shi and Mehdi Asheghi and Michael Barako and Michael Ellsworth and Peter Bock and Ravi Mahajan and Rockwell Hsu and Satish Kumar and Suresh Garimella and Timothy Chainer and Vadim Gektin and Victor Chiriac and Yoonjin Won and Yogi Joshi and Weihua Tang and William Chen",

year = "2019",

language = "American English",

booktitle = "Heterogeneous Integration Roadmap: 2019 Edition",

}

Narumanchi, S, Iyengar, M, Bar-Cohen, A, Merrikh, A, Helmy, A, Malik, A, Sammakia, B, Cola, B, Dogruoz, B, Chan, B, Bottoms, B, Green, C, Singh, D, Refai-Ahmed, G, Yagoobi, J, Weibel, J, Sikka, K, Ghose, K, Goodson, K, Drummond, K, Shi, L, Asheghi, M, Barako, M, Ellsworth, M, Bock, P, Mahajan, R, Hsu, R, Kumar, S, Garimella, S, Chainer, T, Gektin, V, Chiriac, V, Won, Y, Joshi, Y, Tang, W & Chen, W 2019, Chapter 20: Thermal. in Heterogeneous Integration Roadmap: 2019 Edition.

TY - CHAP

T1 - Chapter 20: Thermal

AU - Narumanchi, Sreekant

AU - Iyengar, Madhusudan

AU - Bar-Cohen, Avi

AU - Merrikh, Ali

AU - Helmy, Amr

AU - Malik, Azmat

AU - Sammakia, Bahgat

AU - Cola, Baratunde

AU - Dogruoz, Baris

AU - Chan, Benson

AU - Bottoms, Bill

AU - Green, Craig

AU - Singh, Dhruv

AU - Refai-Ahmed, Gamal

AU - Yagoobi, Jamal

AU - Weibel, Justin

AU - Sikka, Kamal

AU - Ghose, Kanad

AU - Goodson, Kenneth

AU - Drummond, Kevin

AU - Shi, Li

AU - Asheghi, Mehdi

AU - Barako, Michael

AU - Ellsworth, Michael

AU - Bock, Peter

AU - Mahajan, Ravi

AU - Hsu, Rockwell

AU - Kumar, Satish

AU - Garimella, Suresh

AU - Chainer, Timothy

AU - Gektin, Vadim

AU - Chiriac, Victor

AU - Won, Yoonjin

AU - Joshi, Yogi

AU - Tang, Weihua

AU - Chen, William

PY - 2019

Y1 - 2019

N2 - Heterogeneous Integration poses several significant challenges for thermal management at multiple length scales ranging from heat extraction from hot spots, heat transfer through multiple layers of materials, different target temperatures for specific devices/materials, to heat rejection to a system cooling solution or the ambient. This Thermal Working Group (TWG) will consider three areas for thermal management: Die level; Package integration/System-in-Package (SIP)/module level; System level (limited to board level). In addition to the taxonomy of the physical categories listed above, this chapter will focus on articulating the following in quantitative (wherever possible) and qualitative terms: Canonical problems with thermal challenges; Cooling limits for known solutions; Advanced concepts and research.

AB - Heterogeneous Integration poses several significant challenges for thermal management at multiple length scales ranging from heat extraction from hot spots, heat transfer through multiple layers of materials, different target temperatures for specific devices/materials, to heat rejection to a system cooling solution or the ambient. This Thermal Working Group (TWG) will consider three areas for thermal management: Die level; Package integration/System-in-Package (SIP)/module level; System level (limited to board level). In addition to the taxonomy of the physical categories listed above, this chapter will focus on articulating the following in quantitative (wherever possible) and qualitative terms: Canonical problems with thermal challenges; Cooling limits for known solutions; Advanced concepts and research.

KW - heterogeneous integration

KW - thermal management

M3 - Chapter

BT - Heterogeneous Integration Roadmap: 2019 Edition

ER -

Chapter 20: Thermal

Abstract

NREL Publication Number

Keywords

Fingerprint

Cite this