Chapter 20: Thermal

Sreekant Narumanchi, Madhusudan Iyengar, Avi Bar-Cohen, Ali Merrikh, Amr Helmy, Azmat Malik, Bahgat Sammakia, Baratunde Cola, Baris Dogruoz, Benson Chan, Bill Bottoms, Craig Green, Dhruv Singh, Gamal Refai-Ahmed, Jamal Yagoobi, Justin Weibel, Kamal Sikka, Kanad Ghose, Kenneth Goodson, Kevin DrummondLi Shi, Mehdi Asheghi, Michael Barako, Michael Ellsworth, Peter Bock, Ravi Mahajan, Rockwell Hsu, Satish Kumar, Suresh Garimella, Timothy Chainer, Vadim Gektin, Victor Chiriac, Yoonjin Won, Yogi Joshi, Weihua Tang, William Chen

Research output: Chapter in Book/Report/Conference proceedingChapter


Heterogeneous Integration poses several significant challenges for thermal management at multiple length scales ranging from heat extraction from hot spots, heat transfer through multiple layers of materials, different target temperatures for specific devices/materials, to heat rejection to a system cooling solution or the ambient. This Thermal Working Group (TWG) will consider three areas for thermal management: Die level; Package integration/System-in-Package (SIP)/module level; System level (limited to board level). In addition to the taxonomy of the physical categories listed above, this chapter will focus on articulating the following in quantitative (wherever possible) and qualitative terms: Canonical problems with thermal challenges; Cooling limits for known solutions; Advanced concepts and research.
Original languageAmerican English
Title of host publicationHeterogeneous Integration Roadmap: 2019 Edition
StatePublished - 2019

NREL Publication Number

  • NREL/CH-5400-73450


  • heterogeneous integration
  • thermal management


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