Abstract
A mechanism for the transport of H into a Si solar cell during plasma-enhanced chemical vapor deposition (PECVD) of a hydrogenated silicon nitride (SiN:H) layer and its subsequent fire-through metallization process is described. The PECVD process generates process-induced traps, which 'store' H at the surface of the solar cell. This stored H is released and diffuses rapidly into the bulk of Siduring the high-temperature metallization-firing process. During the ramp-down, the diffused H associates with impurities and defects and passivates them. The firing step partially heals up the surface damage. The proposed model explains a variety of observations and experimental results.
Original language | American English |
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Number of pages | 7 |
State | Published - 2005 |
Event | 31st IEEE Photovoltaics Specialists Conference and Exhibition - Lake Buena Vista, Florida Duration: 3 Jan 2005 → 7 Jan 2005 |
Conference
Conference | 31st IEEE Photovoltaics Specialists Conference and Exhibition |
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City | Lake Buena Vista, Florida |
Period | 3/01/05 → 7/01/05 |
NREL Publication Number
- NREL/CP-520-37477
Keywords
- fire-through metallization
- hydrogen transport
- hydrogenated silicon nitride (SiN:H)
- plasma-enhanced chemical vapor deposition (PECVD)
- PV
- solar cells