Copper-Assisted, Anti-Reflection Etching of Silicon Surfaces

Fatima Toor (Inventor)

    Research output: Patent


    A method (300) for etching a silicon surface (116) to reduce reflectivity. The method (300) includes electroless deposition of copper nanoparticles about 20 nanometers in size on the silicon surface (116), with a particle-to-particle spacing of 3 to 8 nanometers. The method (300) includes positioning (310) the substrate (112) with a silicon surface (116) into a vessel (122). The vessel (122) isfilled (340) with a volume of an etching solution (124) so as to cover the silicon surface (116). The etching solution (124) includes an oxidant-etchant solution (146), e.g., an aqueous solution of hydrofluoric acid and hydrogen peroxide. The silicon surface (116) is etched (350) by agitating the etching solution (124) with, for example, ultrasonic agitation, and the etching may include heating(360) the etching solution (124) and directing light (365) onto the silicon surface (116). During the etching, copper nanoparticles enhance or drive the etching process.
    Original languageAmerican English
    Patent number8,815,104
    Filing date26/08/14
    StatePublished - 2014

    Bibliographical note

    Assignee: Alliance for Sustainable Energy, LLC (Golden, CO)

    NREL Publication Number

    • NREL/PT-5J00-62989


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