Creep in Photovoltaic Modules: Examining the Stability of Polymeric Materials and Components

    Research output: Contribution to conferencePaper

    Abstract

    Interest in renewable energy has motivated the implementation of new polymeric materials in photovoltaic modules. Some of these are non-cross-linked thermoplastics, in which there is a potential for new behaviors to occur, including phase transformation and visco-elastic flow. Differential scanning calorimetry and rheometry data were obtained and then combined with existing site-specifictime-temperature information in a theoretical analysis to estimate the displacement expected to occur during module service life. The analysis identified that, depending on the installation location, module configuration and/or mounting configuration, some of the thermoplastics are expected to undergo unacceptable physical displacement. While the examples here focus on encapsulation materials,the concerns apply equally to the frame, junction-box, and mounting-adhesive technologies.
    Original languageAmerican English
    Number of pages9
    StatePublished - 2011
    Event35th IEEE Photovoltaic Specialists Conference (PVSC '10) - Honolulu, Hawaii
    Duration: 20 Jun 201025 Jun 2010

    Conference

    Conference35th IEEE Photovoltaic Specialists Conference (PVSC '10)
    CityHonolulu, Hawaii
    Period20/06/1025/06/10

    NREL Publication Number

    • NREL/CP-5200-47718

    Keywords

    • photovoltaic
    • PV

    Fingerprint

    Dive into the research topics of 'Creep in Photovoltaic Modules: Examining the Stability of Polymeric Materials and Components'. Together they form a unique fingerprint.

    Cite this