Dark Lock-in Thermography Identifies Solder Bond Failure as the Root Cause of Series Resistance Increase in Fielded Solar Modules

Reza Asadpour, Dana B. Sulas-Kern, Steve Johnston, Jenya Meydbray, Muhammad A. Alam

Research output: Contribution to journalArticlepeer-review

17 Scopus Citations

Fingerprint

Dive into the research topics of 'Dark Lock-in Thermography Identifies Solder Bond Failure as the Root Cause of Series Resistance Increase in Fielded Solar Modules'. Together they form a unique fingerprint.

Engineering

Earth and Planetary Sciences

Material Science

Chemical Engineering