Abstract
A fracture mechanics based approach for quantifying adhesion at every interface within the PV module laminate is presented. The common requirements of monitoring crack length and specimen compliance are circumvented through development of a width-tapered cantilever beam method. This technique may be applied at both the module and coupon level to yield a similar, quantitative, measurement. Details of module and sample preparation are described and first results on field-exposed modules deployed for over 27 years presented.
Original language | American English |
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Pages | 106-110 |
Number of pages | 5 |
DOIs | |
State | Published - 18 Nov 2016 |
Event | 43rd IEEE Photovoltaic Specialists Conference, PVSC 2016 - Portland, United States Duration: 5 Jun 2016 → 10 Jun 2016 |
Conference
Conference | 43rd IEEE Photovoltaic Specialists Conference, PVSC 2016 |
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Country/Territory | United States |
City | Portland |
Period | 5/06/16 → 10/06/16 |
Bibliographical note
Publisher Copyright:© 2016 IEEE.
NREL Publication Number
- NREL/CP-5J00-65629
Keywords
- adhesion testing
- backsheet
- encapsulant
- mechanical properties
- reliability