Development of a Fixed Abrasive Slicing Technique (FAST) for Reducing Cost of Photovoltaic Wafers, Final Subcontract Report, 9 January 1991 - 14 April 1991

    Research output: NRELSubcontract Report

    Abstract

    This report examines a wafer slicing technique developed by Crystal Systems, Inc. that reduces the cost of photovoltaic wafers. This fixed, abrasive slicing technique (FAST) uses a multiwire bladepack and a diamond-plated wirepack; water is the coolant. FAST is in the prototype production stage and reduces expendable material costs while retaining the advantages of a multiwire slurry technique.The cost analysis revealed that costs can be decreased by making more cuts per bladepack and slicing more wafers per linear inch. Researchers studied the degradation of bladepacks and increased wirepack life.
    Original languageAmerican English
    Number of pages64
    StatePublished - 1991

    Bibliographical note

    Work performed by Crystal Systems, Inc., Salem, Massachusetts

    NREL Publication Number

    • NREL/SR-214-4485

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