Abstract
This report examines a wafer slicing technique developed by Crystal Systems, Inc. that reduces the cost of photovoltaic wafers. This fixed, abrasive slicing technique (FAST) uses a multiwire bladepack and a diamond-plated wirepack; water is the coolant. FAST is in the prototype production stage and reduces expendable material costs while retaining the advantages of a multiwire slurry technique.The cost analysis revealed that costs can be decreased by making more cuts per bladepack and slicing more wafers per linear inch. Researchers studied the degradation of bladepacks and increased wirepack life.
Original language | American English |
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Number of pages | 64 |
State | Published - 1991 |
Bibliographical note
Work performed by Crystal Systems, Inc., Salem, MassachusettsNREL Publication Number
- NREL/SR-214-4485