Development of a Hybrid Single/Two-Phase Capillary-Based Micro-Cooler Using Copper Inverse Opals Wick with Silicon 3D Manifold for High-Heat-Flux Cooling Application: Preprint

Previously, two-phase capillary-based cooling from narrow (200-1,000 micrometer) heater-bridge copper inverse opal (CIO) wicks with heat flux levels exceeding 1,400 watts per square cm with a low superheat of approximately 10 degrees C was demonstrated. Here, we demonstrate the area scaling of the proposed technology to large-area micro-cooler for the high-heat-flux cooling of microprocessors and power electronics. We developed a hybrid single/two-phase micro-cooler that relies on capillary wicking in 25-micrometer-thick CIOs with an open channel silicon 3D-manifold for liquid delivery and vapor extraction, to achieve a high heat flux of approximately 400 watts per square cm over a heated area of 1 square cm. For the range of inlet water (21 degrees C water temperature) flowrates from 5 to 60 mL per min, we achieved total thermal resistances and vapor qualities of 0.68-0.2 square cm Kelvin per watt and 0.55-0.12, respectively. The high heat flux levels are achieved with flowrates that are 10 times smaller than conventional single- or two-phase microchannel cooling technology. The corresponding two-phase thermal resistances are in the range of 0.05 to 0.02 square cm Kelvin per watt with temperature superheat of 8 to 6 degrees C. While the overall performance of the large-area (10 by 10 square millimeter) capillary-based micro-cooler degraded compared to previous demonstration of the technology for a heated area of 5 by 5 square millimeter, preliminary computational fluid dynamics (CFD) modeling indicates that an improved manifold design will be able to achieve comparable performance.