Abstract
Self-primed ethylene-vinyl acetate (EVA) and non-EVA (PMG) encapsulant formulations were developed that have greater resistance to damp heat exposure at 85 deg C and 85% relative humidity (RH) (in terms of adhesion strength to glass substrates) than a commonly used commercial EVA product. The self-primed EVA formulations were developed on the basis of high-performing glass priming formulationsthat have previously proven to significantly enhance the adhesion strength of unprimed and primed EVA films on glass substrates during damp heat exposure. The PMG encapsulant formulations were based on an ethylene-methylacrylate copolymer containing glycidyl methacrylate.
| Original language | American English |
|---|---|
| Number of pages | 5 |
| State | Published - 2005 |
| Event | 2005 DOE Solar Energy Technologies Program Review Meeting - Denver, Colorado Duration: 7 Nov 2005 → 10 Nov 2005 |
Conference
| Conference | 2005 DOE Solar Energy Technologies Program Review Meeting |
|---|---|
| City | Denver, Colorado |
| Period | 7/11/05 → 10/11/05 |
Bibliographical note
Presented at the 2005 DOE Solar Energy Technologies Program Review Meeting held November 7-10, 2005 in Denver, Colorado. Also included in the proceedings available on CD-ROM (DOE/GO-102006-2245; NREL/CD-520-38557)NREL Publication Number
- NREL/CP-520-38984
Keywords
- ethylene vinyl acetate
- EVA
- EVA
- NREL
- photovoltaics (PV)
- PV
- solar