Development of Damp-Heat Resistant Self-Primed EVA and Non-EVA Encapsulant Formulations at NREL

Research output: Contribution to conferencePaper

Abstract

Self-primed ethylene-vinyl acetate (EVA) and non-EVA (PMG) encapsulant formulations were developed that have greater resistance to damp heat exposure at 85 deg C and 85% relative humidity (RH) (in terms of adhesion strength to glass substrates) than a commonly used commercial EVA product. The self-primed EVA formulations were developed on the basis of high-performing glass priming formulationsthat have previously proven to significantly enhance the adhesion strength of unprimed and primed EVA films on glass substrates during damp heat exposure. The PMG encapsulant formulations were based on an ethylene-methylacrylate copolymer containing glycidyl methacrylate.
Original languageAmerican English
Number of pages5
StatePublished - 2005
Event2005 DOE Solar Energy Technologies Program Review Meeting - Denver, Colorado
Duration: 7 Nov 200510 Nov 2005

Conference

Conference2005 DOE Solar Energy Technologies Program Review Meeting
CityDenver, Colorado
Period7/11/0510/11/05

Bibliographical note

Presented at the 2005 DOE Solar Energy Technologies Program Review Meeting held November 7-10, 2005 in Denver, Colorado. Also included in the proceedings available on CD-ROM (DOE/GO-102006-2245; NREL/CD-520-38557)

NREL Publication Number

  • NREL/CP-520-38984

Keywords

  • ethylene vinyl acetate
  • EVA
  • EVA
  • NREL
  • photovoltaics (PV)
  • PV
  • solar

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