Development of New Low-Cost, High-Performance, PV Module Encapsulant/Packaging Materials: Annual Technical Progress Report, Phase 1, 22 October 2002-30 September 2003

The primary objectives of this subcontract are for Specialized Technology Resources, Inc., to work with U.S.-based PV module manufacturers representing crystalline silicon, polycrystalline silicon, amorphous silicon, copper indium diselenide (CIS), and other state-of-the-art thin-film technologies to develop formulations, production processes, prototype and qualify new low-cost, high-performancephotovoltaic module encapsulants/packaging materials. The manufacturers will assist in identifying each materials' deficiencies while undergoing development, and then ultimately in qualifying the final optimized materials designed to specifically meet their requirements. Upon completion of this program, new low-cost, high-performance, PV module encapsulant/packaging materials will be qualified,by one or more end-users, for their specific application. Information gathering on topics related to thin-film module technology, including device performance/failure analysis, glass stability, and device encapsulation, has been completed. This information has provided concepts and considerations for module failure analysis, accelerated testing design, and encapsulation formulation strategy forthin-film modules.