Dielectrics for Power Electronics Applications

Research output: NRELPresentation


This presentation discusses the role of dielectric materials in power electronic packages. Two dielectric technologies - a dielectric material film-based substrate for insulation and a dielectric coolant - are discussed. The thermal performance benefits of dielectric film-based substrate in comparison with traditional direct-bond-copper substrates are studied through finite element analysis. Also, a novel cooling concept based on dielectric liquids that can contact electrically active surfaces are presented.
Original languageAmerican English
Number of pages17
StatePublished - 2019

Publication series

NamePresented at the Next Generation Dielectric Materials for Electrical Applications, 4-5 December 2019, Cambridge, Massachusetts

NREL Publication Number

  • NREL/PR-5400-75916


  • dielectric cooling
  • dielectric material
  • direct-bond-copper
  • finite element analysis
  • power electronics


Dive into the research topics of 'Dielectrics for Power Electronics Applications'. Together they form a unique fingerprint.

Cite this