@misc{0771ff5a3cb44b139668e1ecda109f2e,
title = "Dielectrics for Power Electronics Applications",
abstract = "This presentation discusses the role of dielectric materials in power electronic packages. Two dielectric technologies - a dielectric material film-based substrate for insulation and a dielectric coolant - are discussed. The thermal performance benefits of dielectric film-based substrate in comparison with traditional direct-bond-copper substrates are studied through finite element analysis. Also, a novel cooling concept based on dielectric liquids that can contact electrically active surfaces are presented.",
keywords = "dielectric cooling, dielectric material, direct-bond-copper, finite element analysis, power electronics",
author = "Paul Paret",
year = "2019",
language = "American English",
series = "Presented at the Next Generation Dielectric Materials for Electrical Applications, 4-5 December 2019, Cambridge, Massachusetts",
type = "Other",
}