Abstract
Thermophotovoltaics are promising solid-state energy converters for a variety of applications such as grid-scale energy storage, concentrating solar-thermal power, and waste-heat recovery. Here, we report the design, fabrication, and testing of large area (0.8 cm2), scalable, single-junction 0.75-eV GaInAs thermophotovoltaic devices reaching an efficiency of 38.8% ± 2.0% and an electrical power density of 3.78 W/cm2 at an emitter temperature of 1,850°C. Reaching such a high emitter temperature and power density without sacrificing efficiency is a direct result of combining good spectral management with an optimized cell architecture, excellent material quality, and low series resistance. Importantly, fabrication of 12 high-performing devices on a 2-in wafer is shown to be repeatable, and the cell design can be readily transferred to commercial epitaxy on even larger wafers. Further improvements in efficiency can be obtained by using a multijunction architecture, illustrated by early results for a two-junction 0.84-eV GaInPAs/0.75-eV GaInAs device.
Original language | American English |
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Pages (from-to) | 2566-2584 |
Number of pages | 19 |
Journal | Joule |
Volume | 6 |
Issue number | 11 |
DOIs | |
State | Published - 2022 |
Bibliographical note
See NREL/JA-5900-83369 for preprintNREL Publication Number
- NREL/JA-5900-84599
Keywords
- energy
- III-V semiconductor
- photovoltaic
- thermal radiation
- thermophotovoltaic