Abstract
Busbars are an integral component of any thin-film photovoltaic module and must be easy and quick to apply by PV manufacturers, as well as provide long-term reliability in deployed modules. Potential reliability issues include loss of adhesion and delamination, chemical instability under current collection conditions (electromigration or corrosion), compatibility of material and applicationmethod with subsequent encapsulation steps. Several new and novel busbar materials and application methods have been explored, including adhering metal busbars with various one- and two-part conductive epoxies or conductive adhesive films, ultrasonic bonding of metal busbar strips, and bonding of busbar strips using low-temperature solders. The most promising approach to date has been the directapplication of metal busbars via various electrochemical techniques, which offers a variety of distinct advantages.
| Original language | American English |
|---|---|
| Number of pages | 5 |
| State | Published - 2005 |
| Event | 2004 DOE Solar Energy Technologies Program Review Meeting - Denver, Colorado Duration: 25 Oct 2004 → 28 Oct 2004 |
Conference
| Conference | 2004 DOE Solar Energy Technologies Program Review Meeting |
|---|---|
| City | Denver, Colorado |
| Period | 25/10/04 → 28/10/04 |
Bibliographical note
Presented at the 2004 DOE Solar Energy Technologies Program Review Meeting, 25-28 October 2004, Denver, Colorado. Also included in the proceedings available on CD-ROM (DOE/GO-102005-2067; NREL/CD-520-37140)NREL Publication Number
- NREL/CP-520-37060
Keywords
- anode pen
- busbar
- electrochemical instrumentation
- electromigration
- integral component
- long-term reliability
- manufacturer
- module
- plating efficiencies
- PV
- thin films
