Abstract
Gallium oxide is an emerging wide band-gap material that has the potential to penetrate the power electronics market in the near future. In this paper, a finite-element gallium oxide semiconductor model is presented that can predict the electrical and thermal characteristics of the device. The finite element model of the two-dimensional device architecture is developed inside the Sentaurus environment. A vertical FinFET device architecture is employed to assess the device's behavior and its static and dynamic behavior. Enhancement-mode device operation is realized with this type of device architecture without the need for any selective area doping. The dynamic thermal behavior of the device is characterized through its short-circuit behavior. Based on the device static and dynamic behavior, it is envisioned that reliable vertical transistors can be fabricated for the power electronics applications.
Original language | American English |
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Number of pages | 7 |
State | Published - 2019 |
Event | ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2019) - Anaheim, California Duration: 7 Oct 2019 → 9 Oct 2019 |
Conference
Conference | ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2019) |
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City | Anaheim, California |
Period | 7/10/19 → 9/10/19 |
Bibliographical note
See NREL/CP-5400-76109 for paper as published in ASME proceedingsNREL Publication Number
- NREL/CP-5400-73791
Keywords
- gallium oxide devices
- high-voltage devices
- power electronics
- power semiconductor devices
- ultra
- wide band-gap
- wide band-gap devices