Environmental Influence on Fracture and Delamination of Electrically Conductive Adhesives

Martin Springer; Nick Bosco

doi:10.1109/PVSC45281.2020.9300480

Environmental Influence on Fracture and Delamination of Electrically Conductive Adhesives

Martin Springer, Nick Bosco

Materials Science

Research output: Contribution to conference › Paper › peer-review

2 Scopus Citations

Abstract

This paper presents our continued work on developing a degradation model for electrically conductive adhesive (ECA) interconnects in photovoltaic modules. Here, we characterize the fracture mechanics properties of an epoxy based ECA, for both critical and subcritical loading conditions. Emphasis is put on the influence of different environmental conditions such as temperature and humidity. We found that high levels of humidity not only weaken the adhesive joint but also promote subcritical debonding at significantly lower driving forces than in dry environments.

Original language	American English
Pages	1110-1113
Number of pages	4
DOIs	https://doi.org/10.1109/PVSC45281.2020.9300480 https://doi.org/10.1109/PVSC45281.2020.9300480
State	Published - 14 Jun 2020
Event	47th IEEE Photovoltaic Specialists Conference, PVSC 2020 - Calgary, Canada Duration: 15 Jun 2020 → 21 Aug 2020

Conference

Conference	47th IEEE Photovoltaic Specialists Conference, PVSC 2020
Country/Territory	Canada
City	Calgary
Period	15/06/20 → 21/08/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

NREL Publication Number

NREL/CP-5K00-76959

Keywords

debonding
electrically conductive adhesives
environmental conditions
fracture mechanics
photovoltaic

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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Cite this

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abstract = "This paper presents our continued work on developing a degradation model for electrically conductive adhesive (ECA) interconnects in photovoltaic modules. Here, we characterize the fracture mechanics properties of an epoxy based ECA, for both critical and subcritical loading conditions. Emphasis is put on the influence of different environmental conditions such as temperature and humidity. We found that high levels of humidity not only weaken the adhesive joint but also promote subcritical debonding at significantly lower driving forces than in dry environments.",

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doi = "10.1109/PVSC45281.2020.9300480",

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AU - Bosco, Nick

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AB - This paper presents our continued work on developing a degradation model for electrically conductive adhesive (ECA) interconnects in photovoltaic modules. Here, we characterize the fracture mechanics properties of an epoxy based ECA, for both critical and subcritical loading conditions. Emphasis is put on the influence of different environmental conditions such as temperature and humidity. We found that high levels of humidity not only weaken the adhesive joint but also promote subcritical debonding at significantly lower driving forces than in dry environments.

KW - debonding

KW - electrically conductive adhesives

KW - environmental conditions

KW - fracture mechanics

KW - photovoltaic

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T2 - 47th IEEE Photovoltaic Specialists Conference, PVSC 2020

Y2 - 15 June 2020 through 21 August 2020

ER -

Environmental Influence on Fracture and Delamination of Electrically Conductive Adhesives

Abstract

Conference

Bibliographical note

NREL Publication Number

Keywords

UN SDGs

Access to Document

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