Evaluating Interconnection Schemes for Semi-Transparent Perovskite Mini-Modules

Colin Bailie; Chris Eberspacher; Timothy Gehan; Rosemary Bramante; Maikel van Hest

doi:10.1109/PVSC40753.2019.9198965

Evaluating Interconnection Schemes for Semi-Transparent Perovskite Mini-Modules

Colin Bailie, Chris Eberspacher, Timothy Gehan, Rosemary Bramante, Maikel van Hest

Materials Science

Research output: Contribution to conference › Paper › peer-review

1 Scopus Citations

Abstract

This work evaluates the critical issues surrounding P1, P2, and P3 scribing for semi-transparent perovskite module integration. We find that P1 scribing procedures are well-translated from other thin-film technologies. P2 scribing is best performed with a mechanical scribe, but remains a source of series resistance. P3 scribing is found to cause an increase in scribing dead area and a potential degradation source.

Original language	American English
Pages	3468-3472
Number of pages	5
DOIs	https://doi.org/10.1109/PVSC40753.2019.9198965 https://doi.org/10.1109/PVSC40753.2019.9198965
State	Published - Jun 2019
Event	46th IEEE Photovoltaic Specialists Conference, PVSC 2019 - Chicago, United States Duration: 16 Jun 2019 → 21 Jun 2019

Conference

Conference	46th IEEE Photovoltaic Specialists Conference, PVSC 2019
Country/Territory	United States
City	Chicago
Period	16/06/19 → 21/06/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

NREL Publication Number

NREL/CP-5K00-78459

Keywords

degradation
electrodes
indium tin oxide
lasers
nanoparticles
photovoltaic cells
substrates

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title = "Evaluating Interconnection Schemes for Semi-Transparent Perovskite Mini-Modules",

abstract = "This work evaluates the critical issues surrounding P1, P2, and P3 scribing for semi-transparent perovskite module integration. We find that P1 scribing procedures are well-translated from other thin-film technologies. P2 scribing is best performed with a mechanical scribe, but remains a source of series resistance. P3 scribing is found to cause an increase in scribing dead area and a potential degradation source.",

keywords = "degradation, electrodes, indium tin oxide, lasers, nanoparticles, photovoltaic cells, substrates",

author = "Colin Bailie and Chris Eberspacher and Timothy Gehan and Rosemary Bramante and {van Hest}, Maikel",

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doi = "10.1109/PVSC40753.2019.9198965",

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Bailie, C, Eberspacher, C, Gehan, T, Bramante, R & van Hest, M 2019, 'Evaluating Interconnection Schemes for Semi-Transparent Perovskite Mini-Modules', Paper presented at 46th IEEE Photovoltaic Specialists Conference, PVSC 2019, Chicago, United States, 16/06/19 - 21/06/19 pp. 3468-3472. https://doi.org/10.1109/PVSC40753.2019.9198965, https://doi.org/10.1109/PVSC40753.2019.9198965

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AU - Gehan, Timothy

AU - Bramante, Rosemary

AU - van Hest, Maikel

PY - 2019/6

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AB - This work evaluates the critical issues surrounding P1, P2, and P3 scribing for semi-transparent perovskite module integration. We find that P1 scribing procedures are well-translated from other thin-film technologies. P2 scribing is best performed with a mechanical scribe, but remains a source of series resistance. P3 scribing is found to cause an increase in scribing dead area and a potential degradation source.

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KW - electrodes

KW - indium tin oxide

KW - lasers

KW - nanoparticles

KW - photovoltaic cells

KW - substrates

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ER -

Evaluating Interconnection Schemes for Semi-Transparent Perovskite Mini-Modules

Abstract

Conference

Bibliographical note

NREL Publication Number

Keywords

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