Evaluating the Performance and Reliability of Screen-Printable Fire-Through Copper Paste on PERC Solar Cells

Suchismita Mitra, Bill Nemeth, Steve Johnston, Harvey Guthrey, Peter Hacke, Ruvini Dharmadasa, Thad Druffel, Kevin Elmer, Apolo Nambo, Dustin Williams, Ajay Upadhyaya, Vijaykumar Upadhyaya, Ajeet Rohatgi, Paul Stradins

Research output: NRELPresentation

Abstract

A bifacial silicon heterojunction solar cell demands approximately 210 mg usage of silver paste (9 busbars, 24.5%, bifacial, M6 size wafer). Copper is an excellent alternative to silver: 100x cheaper, similar elecvtrical resistivities, and 1000x more abundant. Successful demonstration of large area selective emitter PERC solar cells using Cu fire-through paste with FF approximately 75% and approximately 19%. Paste chemistry results in oxide-based Cu diffusion barrier, leading to good reliability of the devices: 1000h DHT giving a 3.5% efficiency drop. The additional series resistance still needs to be lowered. Printed and fired cell performance is governed mostly by pFF, especially J02 ; same for DHT degradation. Further improvement in printing and firing optimization for lower series resistance and higher FF.
Original languageAmerican English
Number of pages19
StatePublished - 2024

Publication series

NamePresented at the 14th International Conference on Silicon Photovoltaics, 15-19 April 2024, Chambery, France

NREL Publication Number

  • NREL/PR-5900-90444

Keywords

  • Ag
  • copper
  • Cu
  • EDS
  • energy-dispersive x-ray spectroscopy
  • fire-through
  • PERC
  • photovoltaic
  • PV
  • screen-printable
  • silver
  • solar cell

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