@misc{71cc2c25f3d94bd0bcdd8b19f1a61839,
title = "Evaluating the Performance and Reliability of Screen-Printable Fire-Through Copper Paste on PERC Solar Cells",
abstract = "A bifacial silicon heterojunction solar cell demands approximately 210 mg usage of silver paste (9 busbars, 24.5\%, bifacial, M6 size wafer). Copper is an excellent alternative to silver: 100x cheaper, similar elecvtrical resistivities, and 1000x more abundant. Successful demonstration of large area selective emitter PERC solar cells using Cu fire-through paste with FF approximately 75\% and approximately 19\%. Paste chemistry results in oxide-based Cu diffusion barrier, leading to good reliability of the devices: 1000h DHT giving a 3.5\% efficiency drop. The additional series resistance still needs to be lowered. Printed and fired cell performance is governed mostly by pFF, especially J02 ; same for DHT degradation. Further improvement in printing and firing optimization for lower series resistance and higher FF.",
keywords = "Ag, copper, Cu, EDS, energy-dispersive x-ray spectroscopy, fire-through, PERC, photovoltaic, PV, screen-printable, silver, solar cell",
author = "Suchismita Mitra and Bill Nemeth and Steve Johnston and Harvey Guthrey and Peter Hacke and Ruvini Dharmadasa and Thad Druffel and Kevin Elmer and Apolo Nambo and Dustin Williams and Ajay Upadhyaya and Vijaykumar Upadhyaya and Ajeet Rohatgi and Paul Stradins",
year = "2024",
language = "American English",
series = "Presented at the 14th International Conference on Silicon Photovoltaics, 15-19 April 2024, Chambery, France",
type = "Other",
}