Evaluation of Low-Pressure-Sintered Multi-Layer Substrates for Medium-Voltage SiC Power Modules: Preprint

Material Science

• Silicon Carbide 100%
• Multilayers 100%
• Silver 60%
• Aluminum 40%
• Sintering 40%
• Defect Density 20%
• Thermal Cycling 20%
• Scanning Electron Microscopy 20%
• Metal-Oxide-Semiconductor Field-Effect Transistor 20%
• Scanning Acoustic Microscopy 20%
• Pressure-Assisted Sintering 20%

Engineering

• Sintering 100%
• Thermal Performance 33%
• Thermal Cycle 33%
• Scanning Acoustic Microscopy 33%
• Metal-Oxide-Semiconductor Field-Effect Transistor 33%
• Operating Voltage 33%
• Silver Paste 33%
• Aluminum Substrate 33%
• Cross Section 33%
• Defect Density 33%
• Electric Field Strength 33%