Abstract
Power electronics are increasingly being used to condition electricity for a wide array of applications, such as transportation (on land, air, and water), data centers, radio frequency, directed energy, wind, solar, and grid-tied applications. To increase power density, performance, efficiency, and reliability and reduce cost, innovations and developments are needed in the multiphysics packaging of power electronics at a die, module, and converter level. This includes fundamental research and development related to emerging high-voltage, high-temperature, and high-switching-frequency power electronics; packaging materials; thermal materials and interfaces; fluid-based thermal management technologies; reliability; condition monitoring; and prognostics. To address these important aspects, this Special Section on Multiphysics Aspects of Power Electronics Packaging includes several articles to be published in two parts. More details are given below on the articles included in the first part.
| Original language | American English |
|---|---|
| Pages (from-to) | 751-753 |
| Number of pages | 3 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 14 |
| Issue number | 5 |
| DOIs | |
| State | Published - 2024 |
NREL Publication Number
- NREL/JA-5400-89640
Keywords
- condition monitoring
- electronic packaging thermal management
- high-voltage techniques
- multichip modules
- power electronics
- power system measurements
- radio spectrum management
- research and development
- special issues and sections
- temperature control
- thermal management