Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging-Power Die, Power Module, and Converter Level: Part 2

Przemyslaw Gromala, Fang Luo, Sreekant Narumanchi

Research output: Contribution to journal › Article › peer-review

Fingerprint

Dive into the research topics of 'Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging-Power Die, Power Module, and Converter Level: Part 2'. Together they form a unique fingerprint.

Engineering

Material Science