Formation of ZnTe:Cu/Ti Contacts at High Temperature for CdS/CdTe Devices

T. A. Gessert, S. Asher, S. Johnston, A. Duda, M. R. Young, T. Moriarty

Research output: Contribution to conferencePaperpeer-review

27 Scopus Citations

Abstract

We study the performance of CdS/CdTe thin-film devices contacted with ZnTe:Cu/Ti of various thickness at a higher-than-optimum temperature of ∼360°C At this temperature, optimum device performance requires the same thickness of ZnTe:Cu as for similar contacts formed at a lower temperature of 320°C C-V analysis indicates that a ZnTe:Cu layer thickness of <∼0.5 μm does not yield the degree of CdTe net acceptor concentration necessary to reduce space charge width to its optimum value for n-p device operation. The thickest ZnTe:Cu layer investigated (1 μm) yields the highest CdTe net acceptor concentration, lowest value of Jo, and highest V oc. However, performance is limited for this device by poor fill factor. We suggest poor fill factor is due to Cu-related acceptors compensating donors in CdS.

Original languageAmerican English
Pages432-435
Number of pages4
DOIs
StatePublished - 2006
Event2006 IEEE 4th World Conference on Photovoltaic Energy Conversion, WCPEC-4 - Waikoloa, HI, United States
Duration: 7 May 200612 May 2006

Conference

Conference2006 IEEE 4th World Conference on Photovoltaic Energy Conversion, WCPEC-4
Country/TerritoryUnited States
CityWaikoloa, HI
Period7/05/0612/05/06

Bibliographical note

For preprint version see NREL/CP-520-39804

NREL Publication Number

  • NREL/CP-520-41281

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