Abstract
A significant challenge facing the solar industry is developing a reliable method to accurately predict photovoltaic module reliability over decades-long operating lifetimes. For the specific case of encapsulant adhesion-where interface delamination directly leads to reduced module efficiency- predictive models are critical for assessing long term reliability of new module materials over time frames conducive to research and development. We thus present a framework for modelling the temporal evolution of encapsulant adhesion by accounting for chemicaldegradation mechanisms at the molecular level. The model is developed though an unprecedented survey of encapsulant adhesion energy measurements from lab and field- aged modules with agingtimes spanning months to nearly three decades. Chemical analyses of new and aged EVA encapsulants are conducted to identify the dominant degradation mechanisms for modelling interface adhesion: Deactivation, polymer chain scission, and hydrolytic polymerization. The strength of this framework is in the model's modularity, which renders it adaptable to any type of aging environment and encapsulation material.
Original language | American English |
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Pages | 3548-3551 |
Number of pages | 4 |
DOIs | |
State | Published - 26 Nov 2018 |
Event | 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - Waikoloa Village, United States Duration: 10 Jun 2018 → 15 Jun 2018 |
Conference
Conference | 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 |
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Country/Territory | United States |
City | Waikoloa Village |
Period | 10/06/18 → 15/06/18 |
Bibliographical note
Publisher Copyright:© 2018 IEEE.
NREL Publication Number
- NREL/CP-5K00-70818
Keywords
- acceleratedaging
- adhesive strength
- delamination
- materials reliability
- photovoltaic cells