Abstract
Hydrogen out-diffusion from the n/i interface region plays a major role in controlling the fill factor (FF) and resultant efficiency of n-i-p a-Si:H devices, with the i-layer deposited at high substrate temperatures by the hot wire technique. Modeling calculations show that a thin, highly defective layer at this interface results in sharply lower device FFs due to the large voltage drops across the defective layer. Increasing the H content, either in the n-layer or an intrinsic low temperature buffer layer with effective thickness could minimize out-diffusion, yielding nearly flat H profiles and much improved device perfomance.
Original language | American English |
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Pages | 119-124 |
Number of pages | 6 |
State | Published - 1999 |
Event | Proceedings of the 1998 MRS Spring Meeting - San Francisco, CA, USA Duration: 14 Apr 1998 → 17 Apr 1998 |
Conference
Conference | Proceedings of the 1998 MRS Spring Meeting |
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City | San Francisco, CA, USA |
Period | 14/04/98 → 17/04/98 |
NREL Publication Number
- NREL/CP-520-24614