Heat Flux Micro Coolers Having Multi-stepped Features and Fluid Wicking

Chi Zhang; Qianying Wu; Muhammad Shattique; Neda Seyedhassantehrani; Souvik Roy; James Palko; Sreekant Narumanchi; Bidzina Kekelia; Sougata Hazra; Kenneth Goodson; Roman Giglio; Ercan Dede; Mehdi Asheghi

Heat Flux Micro Coolers Having Multi-stepped Features and Fluid Wicking

Chi Zhang (Inventor), Qianying Wu (Inventor), Muhammad Shattique (Inventor), Neda Seyedhassantehrani (Inventor), Souvik Roy (Inventor), James Palko (Inventor), Sreekant Narumanchi (Inventor), Bidzina Kekelia (Inventor), Sougata Hazra (Inventor), Kenneth Goodson (Inventor), Roman Giglio (Inventor), Ercan Dede (Inventor), Mehdi Asheghi (Inventor)

Center for Integrated Mobility Sciences

Research output: Patent

Abstract

A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

Original language	American English
Patent number	U.S. 11,729,951 B2
Filing date	15/08/23
State	Published - 2023

NREL Publication Number

NREL/PT-5400-87271

Keywords

cooler device
fluid wicking structure
metal inverse opal (MIO)

Access to Document

https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/11729951

Cite this

@misc{c174a77f7efc4f688133fdbcc4ee6e6b,

title = "Heat Flux Micro Coolers Having Multi-stepped Features and Fluid Wicking",

abstract = "A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.",

keywords = "cooler device, fluid wicking structure, metal inverse opal (MIO)",

author = "Chi Zhang and Qianying Wu and Muhammad Shattique and Neda Seyedhassantehrani and Souvik Roy and James Palko and Sreekant Narumanchi and Bidzina Kekelia and Sougata Hazra and Kenneth Goodson and Roman Giglio and Ercan Dede and Mehdi Asheghi",

year = "2023",

language = "American English",

type = "Patent",

note = "U.S. 11,729,951 B2",

}

TY - PAT

T1 - Heat Flux Micro Coolers Having Multi-stepped Features and Fluid Wicking

AU - Zhang, Chi

AU - Wu, Qianying

AU - Shattique, Muhammad

AU - Seyedhassantehrani, Neda

AU - Roy, Souvik

AU - Palko, James

AU - Narumanchi, Sreekant

AU - Kekelia, Bidzina

AU - Hazra, Sougata

AU - Goodson, Kenneth

AU - Giglio, Roman

AU - Dede, Ercan

AU - Asheghi, Mehdi

PY - 2023

Y1 - 2023

N2 - A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

AB - A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

KW - cooler device

KW - fluid wicking structure

KW - metal inverse opal (MIO)

M3 - Patent

M1 - U.S. 11,729,951 B2

Y2 - 2023/08/15

ER -

Heat Flux Micro Coolers Having Multi-stepped Features and Fluid Wicking

Abstract

NREL Publication Number

Keywords

Access to Document

Fingerprint

Cite this