High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report

Scot Waye

Research output: NRELManagement


Power electronics that use high-temperature devices pose a challenge for thermal management. With the devices running at higher temperatures and having a smaller footprint, the heat fluxes increase from previous power electronic designs. This project overview presents an approach to examine and design thermal management strategies through cooling technologies to keep devices within temperature limits, dissipate the heat generated by the devices and protect electrical interconnects and other components for inverter, converter, and charger applications. This analysis, validation, and demonstration intends to take a multi-scale approach over the device, module, and system levels to reduce size, weight, and cost.
Original languageAmerican English
Number of pages11
StatePublished - 2016

NREL Publication Number

  • NREL/MP-5400-62784


  • inverter cooling
  • power electronics
  • thermal management


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