Hydrogen Passivation and Junction Formation on APIVT-Deposited Thin-Layer Silicon by Hot-Wire CVD

T. H. Wang, Q. Wang, M. R. Page, R. E. Bauer, T. F. Ciszek

Research output: Contribution to journalArticlepeer-review

2 Scopus Citations

Abstract

The hot-wire chemical vapor deposition (HWCVD) technique was employed to deposit μc-Si emitters and a-SiNx:H passivation/antireflection films, and to hydrogenate silicon thin layers grown by atmospheric-pressure iodine vapor transport (APIVT). Photovoltaic devices with HWCVD μc-Si emitters on APIVT epitaxial silicon exhibit greater than 8% efficiency, similar to those made with diffused junctions. On polycrystalline APIVT-Si layers, a HWCVD-deposited μc-Si emitter reduces open-circuit voltage loss caused by grain boundaries. Hot-wire hydrogenation improves Hall mobility by approximately 50%. HWCVD a-SiNx:H films improve minority-carrier lifetime significantly after thermal annealing at temperatures up to 500 °C.

Original languageAmerican English
Pages (from-to)261-264
Number of pages4
JournalThin Solid Films
Volume430
Issue number1-2
DOIs
StatePublished - 2003
EventProceedings of the Second International Conference on CAT-CVD - Denver, CO, United States
Duration: 10 Sep 200213 Sep 2002

NREL Publication Number

  • NREL/JA-520-33240

Keywords

  • APIVT-silicon deposition
  • Heterojunction formation
  • Hot-wire CVD
  • Silicon nitride

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