Abstract
Although excellent reliability has been reported for sintered silver as a die-attach material under both thermal and power cycling loads in power electronics applications, the promise of this material as a large-area attachment at temperatures beyond 200 degrees C needs to be investigated. In this project, we conducted thermal cycling experiments to evaluate the reliability of bonded sintered silver samples under a temperature profile of -40 degrees C to 200 degrees C with high ramp rates. We also included 95Pb5Sn solder in the study to obtain reference data. We performed thermomechanical modeling to compute strain energy density values and correlated these with the experimentally observed crack growth rates to formulate a lifetime prediction model for sintered silver. In addition to sintered silver, we initiated the characterization and reliability evaluation of a transient liquid phase alloy under thermal cycling.
Original language | American English |
---|---|
Number of pages | 8 |
State | Published - 2022 |
Bibliographical note
Progress report for the DOE Vehicle Technologies Office Electrification Annual Progress Report (DOE/EE-2614)NREL Publication Number
- NREL/MP-5400-81237
Keywords
- failure mechanisms
- high-temperature power electronics
- lifetime prediction model
- sintered silver
- transient liquid phase