Abstract
This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. The performance (e.g., thermal resistance, pumping power) of the power electronics cooling technologies developed in this project are compared to the performance of current, on-road technology. One of the main challenges to achieving high power densities is associated with packaging of high-temperature (up to 250 degrees C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors).
| Original language | American English |
|---|---|
| Number of pages | 8 |
| State | Published - 2022 |
Bibliographical note
Progress report for the DOE Vehicle Technologies Office Electrification Annual Progress Report (DOE/EE-2614)NREL Publication Number
- NREL/MP-5400-81176
Keywords
- dielectric fluids
- power density
- power electronics
- thermal management
