Abstract
The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.
Original language | American English |
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Number of pages | 8 |
State | Published - 2022 |
Bibliographical note
Progress report for the DOE Vehicle Technologies Office Electrification Annual Progress Report (DOE/EE-2614)NREL Publication Number
- NREL/MP-5400-81167
Keywords
- interconnects
- packaging
- power electronics
- reliability
- substrates