I.1.7 - Advanced Packaging Designs - Reliability and Prognostics (National Renewable Energy Laboratory)

Douglas DeVoto, Susan Rogers

Research output: NRELManagement

Abstract

The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.
Original languageAmerican English
Number of pages8
StatePublished - 2022

Bibliographical note

Progress report for the DOE Vehicle Technologies Office Electrification Annual Progress Report (DOE/EE-2614)

NREL Publication Number

  • NREL/MP-5400-81167

Keywords

  • interconnects
  • packaging
  • power electronics
  • reliability
  • substrates

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