Investigation of the Interactions Between Low-Temperature Ag Paste Components and SiO2/Poly-Si(n) Contacts and the Impact on Contact Properties: Paper No. 020003

Jonathan Bryan, David Young, Paul Stradins, Zachary Holman

Research output: Contribution to conferencePaper

Abstract

Reducing poly-Si thickness to minimize parasitic absorption on a light-receiving side of a TOPCon solar cell without suffering voltage losses after metallization is a challenge in optimizing TOPCon performance. As an alternative to fire-through pastes, we investigate low-temperature Ag paste to SiO2/poly-Si passivating contacts through fabrication of electrical test structures to characterize the passivation quality and electrical transport across the metallized interface. With current paste chemistries, we find that solvent wetting of the poly-Si surface before evaporation and non-volatile binder resin adhesion to the surface after curing are major impediments which prevent Ag contact formation. However, low- resistance poly-Si/Ag interfaces formed with physical vapour deposition similarly degrade after annealing, indicating contacting issues related to the Ag content even in the absence of the organic paste components.
Original languageAmerican English
Number of pages6
DOIs
StatePublished - 2022
EventSiliconPV 2021: The 11th International Conference on Crystalline Silicon Photovoltaics - Hamelin, Germany
Duration: 19 Apr 202123 Apr 2021

Conference

ConferenceSiliconPV 2021: The 11th International Conference on Crystalline Silicon Photovoltaics
CityHamelin, Germany
Period19/04/2123/04/21

NREL Publication Number

  • NREL/CP-5900-79981

Keywords

  • low temperature Ag paste
  • passivating contact
  • passivation degradation
  • photovoltaic
  • PV
  • TOPCon

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