Investigation of the Interactions Between Low-Temperature Ag Paste Components and SiO2/Poly-Si(n) Contacts and the Impact on Contact Properties

Jonathan Bryan; David Young; Paul Stradins; Zachary Holman

doi:10.1063/5.0090902

Investigation of the Interactions Between Low-Temperature Ag Paste Components and SiO2/Poly-Si(n) Contacts and the Impact on Contact Properties

Jonathan Bryan, David Young, Paul Stradins, Zachary Holman

Chemistry and Nanoscience

Arizona State University

Research output: Contribution to conference › Paper › peer-review

Abstract

Reducing poly-Si thickness to minimize parasitic absorption on a light-receiving side of a TOPCon solar cell without suffering voltage losses after metallization is a challenge in optimizing TOPCon performance. As an alternative to fire-through pastes, we investigate low-temperature Ag paste to SiO2/poly-Si passivating contacts through fabrication of electrical test structures to characterize the passivation quality and electrical transport across the metallized interface. With current paste chemistries, we find that solvent wetting of the poly-Si surface before evaporation and non-volatile binder resin adhesion to the surface after curing are major impediments which prevent Ag contact formation. However, low-resistance poly-Si/Ag interfaces formed with physical vapour deposition similarly degrade after annealing, indicating contacting issues related to the Ag content even in the absence of the organic paste components.

Original language	American English
Number of pages	6
DOIs	https://doi.org/10.1063/5.0090902 https://doi.org/10.1063/5.0090902
State	Published - 24 Aug 2022
Event	11th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2021 - Hamelin, Virtual, Germany Duration: 19 Apr 2021 → 23 Apr 2021

Conference

Conference	11th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2021
Country/Territory	Germany
City	Hamelin, Virtual
Period	19/04/21 → 23/04/21

Bibliographical note

Publisher Copyright:
© 2022 American Institute of Physics Inc.. All rights reserved.

NREL Publication Number

NREL/CP-5900-79981

Keywords

low temperature Ag paste
passivating contact
passivation degradation
photovoltaic
PV
TOPCon

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Bryan, J., Young, D., Stradins, P., & Holman, Z. (2022). Investigation of the Interactions Between Low-Temperature Ag Paste Components and SiO2/Poly-Si(n) Contacts and the Impact on Contact Properties. Paper presented at 11th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2021, Hamelin, Virtual, Germany. https://doi.org/10.1063/5.0090902, https://doi.org/10.1063/5.0090902

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abstract = "Reducing poly-Si thickness to minimize parasitic absorption on a light-receiving side of a TOPCon solar cell without suffering voltage losses after metallization is a challenge in optimizing TOPCon performance. As an alternative to fire-through pastes, we investigate low-temperature Ag paste to SiO2/poly-Si passivating contacts through fabrication of electrical test structures to characterize the passivation quality and electrical transport across the metallized interface. With current paste chemistries, we find that solvent wetting of the poly-Si surface before evaporation and non-volatile binder resin adhesion to the surface after curing are major impediments which prevent Ag contact formation. However, low-resistance poly-Si/Ag interfaces formed with physical vapour deposition similarly degrade after annealing, indicating contacting issues related to the Ag content even in the absence of the organic paste components.",

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Bryan, J, Young, D , Stradins, P & Holman, Z 2022, 'Investigation of the Interactions Between Low-Temperature Ag Paste Components and SiO2/Poly-Si(n) Contacts and the Impact on Contact Properties', Paper presented at 11th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2021, Hamelin, Virtual, Germany, 19/04/21 - 23/04/21. https://doi.org/10.1063/5.0090902, https://doi.org/10.1063/5.0090902

Investigation of the Interactions Between Low-Temperature Ag Paste Components and SiO2/Poly-Si(n) Contacts and the Impact on Contact Properties. / Bryan, Jonathan; Young, David ; Stradins, Paul et al.
2022. Paper presented at 11th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2021, Hamelin, Virtual, Germany.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Investigation of the Interactions Between Low-Temperature Ag Paste Components and SiO2/Poly-Si(n) Contacts and the Impact on Contact Properties

AU - Bryan, Jonathan

AU - Young, David

AU - Stradins, Paul

AU - Holman, Zachary

PY - 2022/8/24

Y1 - 2022/8/24

N2 - Reducing poly-Si thickness to minimize parasitic absorption on a light-receiving side of a TOPCon solar cell without suffering voltage losses after metallization is a challenge in optimizing TOPCon performance. As an alternative to fire-through pastes, we investigate low-temperature Ag paste to SiO2/poly-Si passivating contacts through fabrication of electrical test structures to characterize the passivation quality and electrical transport across the metallized interface. With current paste chemistries, we find that solvent wetting of the poly-Si surface before evaporation and non-volatile binder resin adhesion to the surface after curing are major impediments which prevent Ag contact formation. However, low-resistance poly-Si/Ag interfaces formed with physical vapour deposition similarly degrade after annealing, indicating contacting issues related to the Ag content even in the absence of the organic paste components.

AB - Reducing poly-Si thickness to minimize parasitic absorption on a light-receiving side of a TOPCon solar cell without suffering voltage losses after metallization is a challenge in optimizing TOPCon performance. As an alternative to fire-through pastes, we investigate low-temperature Ag paste to SiO2/poly-Si passivating contacts through fabrication of electrical test structures to characterize the passivation quality and electrical transport across the metallized interface. With current paste chemistries, we find that solvent wetting of the poly-Si surface before evaporation and non-volatile binder resin adhesion to the surface after curing are major impediments which prevent Ag contact formation. However, low-resistance poly-Si/Ag interfaces formed with physical vapour deposition similarly degrade after annealing, indicating contacting issues related to the Ag content even in the absence of the organic paste components.

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KW - passivating contact

KW - passivation degradation

KW - photovoltaic

KW - PV

KW - TOPCon

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Y2 - 19 April 2021 through 23 April 2021

ER -

Investigation of the Interactions Between Low-Temperature Ag Paste Components and SiO2/Poly-Si(n) Contacts and the Impact on Contact Properties

Abstract

Conference

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Keywords

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