Jet Impingement Manifolds for Cooling Power Electronics Modules

Gilbert Moreno; Sreekant Narumanchi; Kevin Bennion; Ramchandra Kotecha; Paul Paret; Xuhui Feng

Jet Impingement Manifolds for Cooling Power Electronics Modules

Gilbert Moreno (Inventor), Sreekant Narumanchi (Inventor), Kevin Bennion (Inventor), Ramchandra Kotecha (Inventor), Paul Paret (Inventor), Xuhui Feng (Inventor)

Center for Integrated Mobility Sciences

National Renewable Energy Laboratory

Research output: Patent

Abstract

The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

Original language	American English
Patent number	11,751,365 B2
Filing date	5/09/23
State	Published - 2023

NREL Publication Number

NREL/PT-5400-87441

Keywords

electrical conductor
first block
power electronics module
second block

Access to Document

https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/11751365

Cite this

@misc{d568600e3d2a4ce2ab01dc352d906ab8,

title = "Jet Impingement Manifolds for Cooling Power Electronics Modules",

abstract = "The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.",

keywords = "electrical conductor, first block, power electronics module, second block",

author = "Gilbert Moreno and Sreekant Narumanchi and Kevin Bennion and Ramchandra Kotecha and Paul Paret and Xuhui Feng",

year = "2023",

language = "American English",

type = "Patent",

note = "11,751,365 B2",

}

TY - PAT

T1 - Jet Impingement Manifolds for Cooling Power Electronics Modules

AU - Moreno, Gilbert

AU - Narumanchi, Sreekant

AU - Bennion, Kevin

AU - Kotecha, Ramchandra

AU - Paret, Paul

AU - Feng, Xuhui

PY - 2023

Y1 - 2023

N2 - The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

AB - The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

KW - electrical conductor

KW - first block

KW - power electronics module

KW - second block

M3 - Patent

M1 - 11,751,365 B2

Y2 - 2023/09/05

ER -

Jet Impingement Manifolds for Cooling Power Electronics Modules

Abstract

NREL Publication Number

Keywords

Access to Document

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Cite this